s/pmarcaMEMORY ROADMAP•3d
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Micron plans memory stacked directly on AI processors by 2028
Micron is planning custom HBM4E for 2027 and memory stacked directly on AI processors in 2028, with new HBM generations nearly every year through 2030. That makes memory less of a plug-in component and more of a tailored part of the AI-chip design.
The demand is forcing the issue: AI training uses roughly four times more HBM per GPU. Micron said it will keep the 6F-squared structure and pursue next-generation 3D DRAM instead of 4F-squared memory, which its CTO said brings too much complexity and cost.
The demand is forcing the issue: AI training uses roughly four times more HBM per GPU. Micron said it will keep the 6F-squared structure and pursue next-generation 3D DRAM instead of 4F-squared memory, which its CTO said brings too much complexity and cost.
Timeline3
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Micron presented product milestones showing memory roadmaps increasingly segmented toward AI-class solutions.
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Micron's roadmap was summarized as custom HBM4E in 2027 followed by 3D-stacked memory directly on AI processors in 2028.
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Micron said it would retain the 6F-squared structure and pursue next-generation 3D DRAM rather than 4F-squared memory.
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